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发明名称
SEMICONDUCTOR MANUFACTURE DEVICE AND HEAT TREATMENT METHOD FOR WAFER BY THE SAME
摘要
申请公布号
JPH10209140(A)
申请公布日期
1998.08.07
申请号
JP19970007123
申请日期
1997.01.20
申请人
SONY CORP
发明人
SAWADA KEIJI
分类号
H01L21/22;H01L21/205;H01L21/31;H01L21/324;(IPC1-7):H01L21/31
主分类号
H01L21/22
代理机构
代理人
主权项
地址
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