| 摘要 |
The present invention relates to a thermal transfer system for heating or cooling a medium. A structure (8, 37, 46, 50, 72, 81, 82, 89, 93, 98, 108, 306, 404) positioned inside a container (4, 34, 124, 302). The structure (8, 37, 46, 50, 72, 81, 82, 89, 93, 108, 306, 404) segments the container (4, 34, 124, 302) into a plurality of compartments (36, 95) wherein a distal end of the structure (8, 37, 46, 50, 72, 81, 82, 89, 93, 108, 306, 404) is in close proximity to an interior surface of the container (10, 33, 42, 91, 122, 210, 316, 414) to allow formation of a thermal transfer bridge (35, 208, 424, 426) that conducts heat into or out of the medium.
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