METHOD AND DEVICE FOR SEALING IC CHIP

摘要

A method and device for sealing IC chip, by which the occurence of imperfect sealing can be eleminated by surely feeding a sealing agent onto the upper surface of a mounting substrate. In the method, prior to feeding the sealing agent (17) a first gap (h1) is provided between a feeding nozzle (15) and the substrate (13) mounted with an IC chip (12), and the IC chip (12) is sealed while the sealing agent (17) is fed by providing a second gap (h2) larger than the first gap (h1) between the nozzle (15) and the substrate (13). After the sealing agent (17) is surely brought into contact with the upper surface of the substrate (13), the IC chip (12) is sealed.