摘要 |
A laser machining apparatus according to the present invention describes characteristics of a laser oscillator (16) with a function among a laser power, a frequency, and a duty ratio, computes an command for a power supply unit (15) in a feed forward control section (14) according to an command based on the function as well as on the power, duty ratio and frequency, computes a command for a power supply unit (15) in the feedback control section (27) from a power command value and a power measurement value from the power sensor (18), and inputs these command to the power supply unit (15). Also the laser machining apparatus detects changes in characteristics in the laser oscillator 16 and corrects a function for characteristics of the laser oscillator (16). <IMAGE> |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
TAKAHASHI, TEIJI, C/O MITSUBISHI DENKI K.K, SANGYO, AMAGASAKI-SHI, HYOGO 661, JP;IMAI, YOSHIHITO, C/O MITSUBISHI DENKI K.K, SANGYO, AMAGASAKI-SHI, HYOGO 661, JP;MORITA, ATSUSHI, C/O MITSUBISHI DENKI K.K, SANGYO, AMAGASAKI-SHI, HYOGO 661, JP;MATSUBARA, MASATO, C/O MITSUBISHI DENKI K.K., HIGASHI-KU, NAGOYA-SHI, AICHI 461, JP;NAGANO, OSAMU, C/O MITSUBISHI DENKI K.K., HIGASHI-KU, NAGOYA-SHI, AICHI 461, JP;FUKUSHIMA, TSUKASA, C/O MITSUBISHI DENKI K.K., HIGASHI-KU, NAGOYA-SHI, AICHI 461, JP |