A MANUFACTURING PROCESS FOR PRINTED CIRCUITS

摘要

A printed circuit manufacturing process includes starting with a piece of conductive material (10) such as copper. One side (11) of the conductive material (10) is chemically machined or cut to form grooves (13) corresponding to the desired design of the printed circuit. A dielectric material (14) is then injection-molded onto the conductive material (10) so that the dielectric material (14) fills the grooves (13) that have been formed in one side (11) of the conductive material (10). The opposite side (12) of the conductive material (10) is then subjected to a process to form the grooves (16) that correspond to the desired printed circuit design (15). The grooves (16) formed during this latter step preferably are coincident with those (13) formed in a previous machining step. In one embodiment, more than one assembly of dielectric and conductive material are adhered together to form a double faced circuit.