发明名称 BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD
摘要 <p>A ball arranging substrate is provided with a substrate having a main surface and a plurality of arranging holes for holding fine conductive balls by suction formed on the main surface at the positions corresponding to the electrodes of a semiconductor element, circuit board, etc. At the time of optically discriminating the normal/abnormal condition of the arranging state of the fine conductive balls from the light reflected from the ball arranging surface of the substrate on which the balls are held by suction by irradiating the ball arranging surface with light, the wavelength of the irradiating light is set within the range of 300-900 nm and, at the same time, the reflectance of the ball arranging surface to the light is set at ≤50 %. When the arranging substrate has a light transmitting property, however, the reflectance is measured by positioning a reflecting mirror on the opposite side of the substrate to the light source.</p>
申请公布号 WO1998034273(P1) 申请公布日期 1998.08.06
申请号 JP1997003011 申请日期 1997.08.28
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