| 摘要 |
An improved printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame (30) sandwiched between two multilayer substrates (10). Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent. <IMAGE> |
