PROCESS FOR PRODUCING VERTICALLY CONNECTED SEMICONDUCTOR COMPONENTS

摘要

PCT No. PCT/DE94/00486 Sec. 371 Date Nov. 3, 1995 Sec. 102(e) Date Nov. 3, 1995 PCT Filed May 2, 1994 PCT Pub. No. WO94/25981 PCT Pub. Date Nov. 10, 1994A process for producing components having a contact structure provides for vertical contact-making, in which, for the connection of a metal contact of a first component to a metal contact of a second component, the substrate is etched out, starting from the top, in a region provided for a vertical, conductive connection, this recess is filled with a metal so that said metal is connected to the surface of the metal contact, the rear side of the substrate is removed until the metal projects beyond the rear side, a metallization layer made of a metal having a low melting point, for example AuIn, is applied to the metal contact of the second component, the surface of the second component is provided with a planar layer, the two components are arranged vertically with respect to one another and a permanent contact is produced between the metal of the first component and the metallization layer of the second component by pressing one onto the other and heating.