发明名称 Dopant profile spreading for arsenic source/drain
摘要 An improved process for forming shallow arsenic-doped source/drain regions in MOS devices utilizes a two-step arsenic implant which lowers the surface arsenic concentration while maintaining sharp junction profile and desired junction depth. Minimizing the excess arsenic in the surface region improves silicidation characteristics.
申请公布号 US5789802(A) 申请公布日期 1998.08.04
申请号 US19960667570 申请日期 1996.06.21
申请人 ADVANCED MICRO DEVICES, INC. 发明人 TRIPSAS, NICHOLAS H.
分类号 H01L21/265;H01L21/8234;H01L29/08;H01L29/45;(IPC1-7):H01L29/67;H01L29/76;H01L29/94 主分类号 H01L21/265
代理机构 代理人
主权项
地址