发明名称 Etch-ending point measuring method for wet-etch process
摘要 A wet-etching method which determines a desired etch-ended point includes the steps of providing an etchant solution in a bath, performing the wet-etch process by dipping a material to be etched in the bath, measuring a weight variation value of the material during the wet etch process, calculating a thickness variation value of the material by using the weight variation value, and stopping the wet-etch process when the thickness variation value reaches a preset value.
申请公布号 US5788871(A) 申请公布日期 1998.08.04
申请号 US19960633018 申请日期 1996.04.16
申请人 LG SEMICON CO., LTD. 发明人 HUH, YUN JUN
分类号 H01L21/306;C23F1/00;G01N5/04;G01N17/00;H01L21/268;H01L21/308;H01L21/66;(IPC1-7):C23F1/00;C25F3/00 主分类号 H01L21/306
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