| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject adhesive evaporating little volatile components in bonding work and capable of protecting soldered part from the moisture on a lead wire by using a dianhydride in combination with a mixture of an aromatic diamine and an aliphatic diamine. SOLUTION: This polyimide adhesive contains a reaction product of (A) an aromatic dianhydride with (B) a diamine mixture consisting of (i) about 50-95mol% of an aromatic diamine and (ii) about 5-50mol% of an aliphatic diamine. A bond is formed between an integrated circuit chip and a lead frame by applying the polyimide adhesive free from polysiloxane bond and heating and then cooling the polyimide. Preferably, the component A is 3,3',4,4'- benzophenonetetracarboxylic acid dianhydride, etc., the component (i) is 1,3-bis(3- aminophenoxy)benzene, etc., and the component (ii) is anα,ω-diamine. |
