发明名称 |
Surface mount peripheral leaded and ball grid array package |
摘要 |
A surface mounted integrated circuit die package includes a group of peripheral leads extending laterally outwardly from the perimeter of the package and also includes an array of solder balls on the bottom of the package. The arrangement provides for a greater number of input/output connections to a die package by utilizing both peripheral leads and a ball grid array without requiring increases in package size or a reduction in the width of electrically conductive interconnections.
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申请公布号 |
US5789811(A) |
申请公布日期 |
1998.08.04 |
申请号 |
US19960725735 |
申请日期 |
1996.10.04 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
CHIA, CHOK J.;VARIOT, PATRICK |
分类号 |
H01L23/12;H01L23/24;H01L23/31;H01L23/495;H01L23/498;H05K3/34;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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