发明名称 LAPPING SOLUTION COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To obtain the subject composition for silicon or the like, excellent in compounding stability of abrasive grains and good in fluidity by using specific glycol ether and abrasive grains. SOLUTION: This composition comprises 1 to 70wt.% of a glycol ether shown by the formula R<1> O(Cn H2n O)m R<2> (R<1> is a 1-18C alkyl, alkenyl, alkylphenyl or phenyl; R<2> is a 1-4C alkyl; (m) is 1 to 10; and (n) is 2-4), and (B) 30 to 70wt.% of abrasive grains. It is recommended that the component A has a solubility parameter of 7.5 to 9.0, e.g. ethylene glycol dimethyl ether, and the component B has an average grain size of 2 to 20μm, e.g. silicon carbide or diamond.</p>
申请公布号 JPH10204419(A) 申请公布日期 1998.08.04
申请号 JP19970020090 申请日期 1997.01.16
申请人 SANYO CHEM IND LTD 发明人 KAWAGUCHI KOJI;NAGAI KUNIO
分类号 B24B37/00;C09K3/14;(IPC1-7):C09K3/14 主分类号 B24B37/00
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