| 摘要 |
PROBLEM TO BE SOLVED: To increase application time and to obtain stable application without lengthening one cycle time. SOLUTION: A carrier tape 1 is sent one pitch a time by chain sprockets 3, 4. At an IC insertion position, an IC is inserted in the pocket 1a of the carrier tape 1. Several pitches after that, a clamp moving unit 10 is provided, and a cover tape 7 is overlaid on the carrier tape 1 at this position. When one pitch movement of the carrier tape is completed, a tape application tool 11 moves down to clamp the carrier tape 1 and the cover tape 7 between the tape application tool 11 and a carrier tape receiver 22, and thermocompression bonding is started. In this condition, the chain sprockets 3, 4 start rotating, and simultaneously, the tape application tool 11 and the carrier tape receiver 22 also start moving, transporting the tape at one pitch. After this, the application tool 11 and the tape receiver 22 return to the initial position. |
