Position sensor housing having duroplastic molding compound and thermoplastic molding compound

摘要

A sensor and process for manufacturing same having an electrical circuit arranged on a carrier which is connected to an electrical connector and a sensor element. The carrier is disposed within a housing having one opening for the connector element and another opening for the sensor element. The sensor element and a first part of the carrier with the electrical circuit are embedded in a duroplastic molding compound. A second part of the carrier with the electrical circuit and the electrical connector are enclosed by a thermoplastic molding compound. A seal is arranged adjacent an intermediate space between the duroplastic molding compound and the housing.