| 摘要 |
Heat generated by a processor within the base housing portion of a notebook computer is received, spread, and dissipated through an exterior wall of the housing by a heat transfer pad structure in which a spaced series of porous plastic tube members, each having a quantity of purified water therein, are individually and sealingly encapsulated in partially evacuated pocket areas formed between two facing sheets of a high temperature polyimide film material. A metal heat receiving block member is positioned between and contacts the processor and a portion of one side of the pad structure, with the opposite side of the pad structure contacting the exterior housing wall. Heat generated by the processor is conducted through the metal block and into first longitudinal portions of the porous, liquid containing tubes which responsively function as thermosyphoning heat pipes to spread the received heat along the pad structure away from the heat receiving block and dissipate the heat into the exterior housing wall for transfer to ambient, thereby substantially reducing the creation of thermal hot spots on the housing during computer operation.
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