| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition improving compatibility and adhesion of a hydrophobic resin consisting of an epoxy resin and a phenolic resin with an inorganic filler, excellent in molding property and without increasing viscosity or a decreasing strength of a cured material by blending a specific compound. SOLUTION: This epoxy resin composition is obtained by blending an epoxy resin composition containing (A) an epoxy resin, (B) a phenolic resin and (C) an inorganic filler as indispensable components, using either one or both of a resin mainly consisting of a hydrophobic epoxy resin having >=8 ratio of the carbon numbers excluding the glycidyl groups to the total number of the glycidyl groups and hydroxyl groups as the component (A) and a resin mainly consisting of a phenolic resin having >=8 ratio of the total number of carbon to the total number of hydroxyl groups as the component (B) and also containing 650-1100 pt.wt. component (C) based on 100 pts.wt. total of the components (A) and (B), with (D) 0.02-1wt.% polyether-modified silicone suitably a compound of the formula [R is a 1-8C alkyl; R<1> is epoxy, amino, etc.; R<2> is a polyether group; R<3> is a (non)-substituted monovalent hydrocarbon]}. |
