发明名称 |
Method for dissipating heat from an integrated circuit |
摘要 |
A heat sink apparatus dissipates heat from an integrated circuit which is connected to a printed circuit board. A support member is connected to the circuit board for supporting the integrated circuit with respect to the circuit board. A metal tab in thermal communication with the integrated circuit extends from the support member in a plane substantially parallel to the circuit board. An electrically insulating thermally conductive compressible pad is positioned in contact with the metal tab for receiving heat from the tab when compressed. A thermally conductive housing is positioned adjacent the pad for compressing the pad against the tab and for receiving heat from the pad when compressed. The housing includes a plurality of fins extending therefrom for heat dissipation. A method for dissipating heat from an integrated circuit which is connected to a printed circuit board is also provided.
|
申请公布号 |
US5787576(A) |
申请公布日期 |
1998.08.04 |
申请号 |
US19960726315 |
申请日期 |
1996.10.03 |
申请人 |
BORG-WARNER AUTOMOTIVE, INC. |
发明人 |
WARREN, JAMES DAVID;VOGT, CARL RANDALL;KLOOZ, CHARLES DAVID |
分类号 |
G06F1/20;H01L23/40;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|