发明名称 |
Method for assembling a heat sink to a die paddle |
摘要 |
A method of assembly an integrated circuit die to a heat sink by first providing a lead frame that has a die-attach paddle portion having a top surface, a bottom surface, and an opening therethrough, positioning a heat sink having a raised portion on its top surface abutting the bottom surface of the die-attach paddle portion, and then frictionally engaging the heat sink and the die-attach paddle together and bonding an integrated circuit chip to the top surface of the heat sink with an adhesive material sandwiched therein between such that the assembly can be placed in a mold apparatus for forming a plastic encapsulated package.
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申请公布号 |
US5789270(A) |
申请公布日期 |
1998.08.04 |
申请号 |
US19960594254 |
申请日期 |
1996.01.30 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
JENG, JIAN DIH;WANG, HSING SENG |
分类号 |
H01L23/433;H01L23/495;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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