| 摘要 |
An optical component (40) is formed by bonding a light generating device (43) onto a transparent substrate (41). The light generating device can be attached to the transparent substrate (41) using a flip-chip bond. A light detecting device (51) is also bonded to the transparent substrate (41) and positioned so that a portion of the optical signal provided by the light generating device (43) is reflected to the light detecting device (51) through the transparent substrate (41). A holographic film (42) may be formed on the transparent substrate (41) to diffuse the optical signal provided by the light generating device (43).
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