发明名称 |
Interleaved-fin thermal connector |
摘要 |
In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.
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申请公布号 |
US5787976(A) |
申请公布日期 |
1998.08.04 |
申请号 |
US19960674031 |
申请日期 |
1996.07.01 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
HAMBURGEN, WILLIAM R.;FITCH, JOHN S.;EUSTACE, ROBERT A. |
分类号 |
F28F3/02;H01L21/48;H01L23/367;H01L23/433;(IPC1-7):F28F7/00 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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