发明名称 Interleaved-fin thermal connector
摘要 In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.
申请公布号 US5787976(A) 申请公布日期 1998.08.04
申请号 US19960674031 申请日期 1996.07.01
申请人 DIGITAL EQUIPMENT CORPORATION 发明人 HAMBURGEN, WILLIAM R.;FITCH, JOHN S.;EUSTACE, ROBERT A.
分类号 F28F3/02;H01L21/48;H01L23/367;H01L23/433;(IPC1-7):F28F7/00 主分类号 F28F3/02
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