发明名称 |
Contact agency interposed between IC and IC receptacle |
摘要 |
Between an IC and an IC receptacle is interposed a flexible wiring sheet, via which contact pieces of the IC and contacts of the IC receptacle are held in contact with one another. In this case, lateral deviation and flexing of the wiring sheet are prevented satisfactorily, and proper contact between the IC and IC receptacle is ensured. A back-up frame is applied by adhesive to the flexible wiring sheet to form a contact agency. The back-up frame 11 has a central window 11 to form a non-backed-up region in a central portion of the flexible wiring sheet 3 that covers the window. The IC 3 and flexible wiring sheet are held in forced contact with each other in the non-backed-up region. The back-up frame has an outer edge portion forming a back-up region for backing up an edge portion of the wiring sheet. In this back-up region, the IC receptacle and the flexible wiring sheet 1 are held in contact with each other. |
申请公布号 |
US5789804(A) |
申请公布日期 |
1998.08.04 |
申请号 |
US19960633549 |
申请日期 |
1996.04.17 |
申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
MATSUOKA, NORIYUKI;URATSUJI, KAZUMI |
分类号 |
H01R33/76;G01R1/04;H01L23/32;H01L23/498;H01R13/24;H01R13/64;H01R31/06;H01R33/94;(IPC1-7):H01L23/495 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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