| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition as a processing aid, capable of polishing a surface at a high speed without leaving defects on the surface by incorporating an organic compound having a specific molecular structure. SOLUTION: This composition comprises at least (A) a processing aid and (B) water, wherein the component A is a water-soluble or water-dispersible organic compound having a weight-average molecular weight of 500 to 1,000,000 and poly (>=3) nuclear condensed ring. It is preferable that the composition contains 0.01 to 30wt.% of the component A, the compound having 0.1 to 4 of at least one of sulfonic group, carboxyl group, phosphoric group and the like on the average per 500 units of the molecular weight, e.g. condensed sodium tannate sulfonate. |
