发明名称 |
INNER LEAD METHOD OF LEAD FRAME |
摘要 |
The present invention relates generally to a lead frame which is bended with a predetermined angle many times in order that a sectional area of a punch to form two lead lines which are located in the center of tie bars is increased, and increase the inertial moment as to a sectional area in making a lead frame of a desired shape. And the above-mentioned lead frame comprises a dambar; inner leads which has a certain angle at the part being below half the distance from lead tips to the above-mentioned dambar, and is connected to the above-mentioned dambar; outer leads which is connected to the above-mentioned dambar, and is populated on a circuit board; and tie bars which support the above-mentioned inner leads in case of taping. |
申请公布号 |
KR0148203(B1) |
申请公布日期 |
1998.08.01 |
申请号 |
KR19950014843 |
申请日期 |
1995.06.05 |
申请人 |
SAMSUNG AEROSPACE IND. CO.,LTD |
发明人 |
KIM, YONG-YEUN;HAN, SUNG-YOUNG |
分类号 |
B21D28/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 |
主分类号 |
B21D28/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|