发明名称 INNER LEAD METHOD OF LEAD FRAME
摘要 The present invention relates generally to a lead frame which is bended with a predetermined angle many times in order that a sectional area of a punch to form two lead lines which are located in the center of tie bars is increased, and increase the inertial moment as to a sectional area in making a lead frame of a desired shape. And the above-mentioned lead frame comprises a dambar; inner leads which has a certain angle at the part being below half the distance from lead tips to the above-mentioned dambar, and is connected to the above-mentioned dambar; outer leads which is connected to the above-mentioned dambar, and is populated on a circuit board; and tie bars which support the above-mentioned inner leads in case of taping.
申请公布号 KR0148203(B1) 申请公布日期 1998.08.01
申请号 KR19950014843 申请日期 1995.06.05
申请人 SAMSUNG AEROSPACE IND. CO.,LTD 发明人 KIM, YONG-YEUN;HAN, SUNG-YOUNG
分类号 B21D28/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 主分类号 B21D28/00
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