发明名称 |
SEMICONDUCTOR PACKAGE HAVING DIVISION PAD |
摘要 |
A semiconductor package including a semiconductor chip having a plurality of bonding pads, a die pad onto which the chip is mounted using a non-conductive adhesive, and a lead frame formed so as to have a plurality of inner and outer leads connected electrically to the bonding pads. The die pad is split into two or more segments, which are coupled together through a non-conductive connector. |
申请公布号 |
KR0148077(B1) |
申请公布日期 |
1998.08.01 |
申请号 |
KR19950019636 |
申请日期 |
1995.07.05 |
申请人 |
SAMSUNG ELECTRONICS CO.,LTD |
发明人 |
KWON, YOUNG-DO |
分类号 |
H01L23/04;H01L23/02;H01L23/48;H01L23/495;H01L23/50 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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