发明名称 |
Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial |
摘要 |
In using a photoinitiator and irradiation with UV-light suitable monomers can be selectively inoculated on the surface of a non conducting substrate in a distinct pattern. Metal ions are thereafter absorbed by these monomers and are reduced. To this pattern further conducting materials, e.g., metals, can thereafter be added in a conventional way. The method according to the invention comprises a fully additive method to produce a circuit board with high resolution and the production of functional components directly on a non conducting substrate. |
申请公布号 |
SE9700307(L) |
申请公布日期 |
1998.08.01 |
申请号 |
SE19970000307 |
申请日期 |
1997.01.31 |
申请人 |
CUPTRONIC AB |
发明人 |
LARSSON KARL-GUNNAR;PETTERSSON ALF LAGE;HEDLUND STIG TOMAS;FORSLING WILLIS RUDOLF;LINDBERG MATS EINAR EUGEN;GUNNERIUSSON LARS ANDERS |
分类号 |
C23C26/00;C23C18/16;H05K3/18;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
C23C26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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