发明名称 Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial
摘要 In using a photoinitiator and irradiation with UV-light suitable monomers can be selectively inoculated on the surface of a non conducting substrate in a distinct pattern. Metal ions are thereafter absorbed by these monomers and are reduced. To this pattern further conducting materials, e.g., metals, can thereafter be added in a conventional way. The method according to the invention comprises a fully additive method to produce a circuit board with high resolution and the production of functional components directly on a non conducting substrate.
申请公布号 SE9700307(L) 申请公布日期 1998.08.01
申请号 SE19970000307 申请日期 1997.01.31
申请人 CUPTRONIC AB 发明人 LARSSON KARL-GUNNAR;PETTERSSON ALF LAGE;HEDLUND STIG TOMAS;FORSLING WILLIS RUDOLF;LINDBERG MATS EINAR EUGEN;GUNNERIUSSON LARS ANDERS
分类号 C23C26/00;C23C18/16;H05K3/18;H05K3/38;(IPC1-7):H05K3/38 主分类号 C23C26/00
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