发明名称 |
LEAD FRAME MANUFACTURE METHOD AND THE USE SEMICONDUCTOR PACKAGE MANUFACTUR MATHOD |
摘要 |
A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad. |
申请公布号 |
KR0148080(B1) |
申请公布日期 |
1998.08.01 |
申请号 |
KR19950023471 |
申请日期 |
1995.07.31 |
申请人 |
SAMSUNG LECTRONICS CO.,LTD |
发明人 |
KIM, SANG-HOON;SIM, SUNG-MIN;HONG, INN-PYO;LEE, SANG-KOOK |
分类号 |
H01L21/56;H01L23/495;H01L23/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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