| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire-bonding method and apparatus therefor, which is superior in production efficiency and capable of test works parallel to the bonding works on the same stage to reduce the apparent test time to zero. SOLUTION: This apparatus comprises a camera 6, a large-aperture condenser lens 7 disposed between the camera and a lead frame 2, a rotary diaphragm 8 having an opening 9 at a specified position, a motor 10 for driving the diaphragm 8, an illumination lamp fixed to a position symmetric to the opening 9 with an optical axis 0, disposed therebetween and judging circuit 17 for detecting the bonding condition of bonding completed adjacent pads and leads for one wire previous from image signals taken by the camera 6 to judge from the detected information, whether the bonding condition of the pads and leads before one wire is judged on quality. |
