发明名称 VACUUM FORMING DIE STRUCTURE FOR WIRE HARNESS, AND VACUUM FORMING METHOD USING THE DIE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To apply vacuum forming only to the vacuum forming part of a wire harness. SOLUTION: This structure 21 is constituted of a vacuum forming die 23 and the case 25 of the die 23. The die 23 is provided with a wiring surface 35 for wiring the vacuum forming part 27 of wire harness 31, and many evacuating holes provided on the wiring surface 35 to suck air to tightly join an insulating sheet into the vacuum forming part 27, and a space 47 for foldedly housing a non-vacuum-forming portion 29 is provided on the case 25.
申请公布号 JPH10199347(A) 申请公布日期 1998.07.31
申请号 JP19970006558 申请日期 1997.01.17
申请人 YAZAKI CORP 发明人 TAKANO YOICHI
分类号 H01B13/012;H01B13/00 主分类号 H01B13/012
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