| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting semiconductor chip components on a substrate at a high efficiency and with high reliability of mounting work. SOLUTION: On pads 2 of a semiconductor chip 1, the top ends of conductive wires 5 are compression-bonded, the wires 5 are torn to form double-stepped bumps 6, composed of upper steps 6a and lower steps having vols. larger than those of the upper steps on the pads 2. Only the upper steps 6a of the bumps 6 are pressed to a flattening tool 7 having a flat face so as to approximately level them in height, a conductive paste 8 is deposited to the bumps 6, adhesive 9 is applied to a substrate 3, the pads 2 are positioned to corresponding lands of the substrate 3, and the chip 1 while being heated is pressed to the substrate 3 by a mounting tool 10 to plastically deform all the upper and lower steps 6a, 6b of the bumps 6. |
