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发明名称
MOLDING COMPONENT
摘要
申请公布号
JPH10200832(A)
申请公布日期
1998.07.31
申请号
JP19970000825
申请日期
1997.01.07
申请人
SONY CORP
发明人
IWAI YUUJI;TAGUCHI HIDEYUKI;NOZUYAMA SATOSHI
分类号
H04N5/64;(IPC1-7):H04N5/64
主分类号
H04N5/64
代理机构
代理人
主权项
地址
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