| 摘要 |
PROBLEM TO BE SOLVED: To prevent defects of TCP and poor connection of TCP and a panel by providing connection electrodes composed of metal lead wire electrodes only at the openings of a film base and position recognition mark between at least two electrodes. SOLUTION: On a film base 2, semiconductor elements 3 are mounted with wiring patterns 4a, 4b formed there. Connection electrodes 5a, 5b composed only of metal lead wire electrodes 5a, 5b are connected to inputs and outputs of the semiconductor elements 3, thereby connecting a tape carrier package TCP 1 to external members through the electrodes 5a, 5b. Position recognition marks 7 are formed on the electrodes 5b at both sides of the output connection electrodes. Since the position recognition marks do not project from the connection electrodes, so that there are no damages to avoid the defect of TCP or the recognition error at aligning with a panel. |
