| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and a container of the component for stably mounting the component in high density. SOLUTION: Electronic components 11 have many extended leads 13 from one side of a molding 12 and extended down at legs 14 from both sides of the molding 12. The leads 13 are landed on a solder part 18 on electrodes 17 of a board 16, and circular arc surfaces 15 of lower ends of the legs 14 are landed on the board 16 to be mounted. The moldings 12 are mounted in a forward tilting attitude. And, a plurality of the components 11 are partly overlapped and mounted to reduce an occupying width W4 and to mount in high density. Since the molding 12 is mounted in the forward tilting attitude, leads 13 are supply pressed to the part 18 and soldered. |
