| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture of a multilayer interconnection board efficiently having a fine IVH without largely changing the manufacturing facility and a method of the normally used multilayer interconnection board. SOLUTION: An internal-layer wiring board 4 is manufactured, and metallic foil 3 with adhesives consisting of metallic foil and adhesive resin layers is bored. The above-mentioned internal-layer wiring board 4 and the metallic foil 3 with adhesives are superposed, and sheets 2 plastically fluidized under a heated and pressed state are interposed between laminating jigs, and heated and pressed and laminated and bonded. A board, in which the sheets 2 plastically fluidized under the above-mentioned heated and pressed state are peeled and removed physically after laminating and bounding and which is laminated and bonded, is treated with a solution having decomposing and dissolving property to the sheets 2 plastically fluidized under the above-mentioned heated and pressed state. Plating for electrically connecting the circuits of the internal- layer wiring boards 4 and the metallic foil 3 is conducted, and a plating conductor and the metallic foil are worked and circuits are formed. |
