| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the connection of a high-polymer waveguide and an optical fiber by heating the high-polymer waveguide to a temp. above the softening point of a thermally softening binder removing the high-polymer waveguide and washing the same. SOLUTION: The high-polymer waveguide 3 is formed over the entire surface of a substrate 1 subjected to a primer treatment. A transparent material supporting base 4 is fixed by the thermally softening binder 5 to the rear surface of the substrate 1. A transparent material cover 7 is fixed thereon by the thermally softening binder 6 having a lower softening point. The substrate is cut for the purpose of forming chips of waveguide parts and for forming V-grooves 10 for fitting guide pins for positioning. The transparent cover 7 is removed by heating to the temp. higher than the softening point of the thermally softening binder for fixing the transparent material cover 7 and lower than the softening point of the thermally softening binder for fixing the transparent material supporting base 4 and thereafter, the supporting base is fixed to the surface by the thermally softening binder 6. The boundary between the part coated with the primer and the part not coated with the primer is cut from the side of the transparent material supporting base 4 down to the depth arriving at the high-polymer waveguide layer 3. The high-polymer waveguide is removed by heating up to the softening point of the thermally softening binder 5 and is washed by ultrasonic washing, etc. |
