CONDUCTIVE ADHESIVE AND METHOD OF MOUNTING COMPONENTS, USING THE SAME

摘要

PROBLEM TO BE SOLVED: To easily provisionally fix components by thermally hardening a thermosetting resin contg. conductive grains at a second temp, higher than a first temp. at which at least the surfaces of the grains intermetallically react with a metal. SOLUTION: Conductive grains 31 mixed in an adhesive 30 are In-coated Ag grains of 5μm in mean size. Components 20 are mounted through the adhesive 30 and pressed to a wiring board 10 and it is heated at 150 deg.C (first temp.) for 30sec. to provisionally fix the components where stud bumps 25 of the components 20, In of the grains 31 and electrodes 12 on the board 10 melt in the intermetallic reaction to make them conductive by the heat at 150 deg.C. The adhesive is heated at 200 deg.C (second temp.) for 1min to harden the adhesive to regularly connect the components 20 to the board, thereby easily provisionally fixing the components.