| 摘要 |
PROBLEM TO BE SOLVED: To provide a capillary which is easy to position and re-position at wire bonding in an IC circuit chip package manufacturing process. SOLUTION: A capillary 10 can be incorporated in a wire-bonding machine and has one or more indicators 100, 105, 110 which may be disposed around a capillary. The indictor detection for detecting the angle position of the indicator is made by a detector 160 to determine the angle-alignment of the capillary. To most effectively perform the wire bonding between an integrated circuit chip and lead frame conductors, this angle alignment may be made to correspond to a table of the wire-bonding machine or required shaft of the lead frame. The capillary may have a circular or non-circular face. |
