发明名称 |
ULTRA-HIGH FREQUENCY PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To realize an ultra-high frequency and small loss package for microwave and millimeter wave use. SOLUTION: The package has a strip line at a feed-through part. The strip line has a slit at the center conductor 23 to relax the current concentration on the strip line end, reduces the pass loss, and utilizes the suppression effect of the slit for unwanted modes. The center conductor or part thereof uses a high-m.p. metal thin wire 24 having approximately a circular section which can be baked with ceramics 9 such as alumina. The characteristic impedance of the strip line at the feed-through part is set to a higher value than specified characteristic impedance. |
申请公布号 |
JPH10200042(A) |
申请公布日期 |
1998.07.31 |
申请号 |
JP19970242964 |
申请日期 |
1997.09.08 |
申请人 |
TOSHIBA CORP |
发明人 |
KONNO YOSHIO;HANAWA TAKESHI;IZEKI YUJI |
分类号 |
H01L23/12;H01L23/50;H01P3/08;H01P5/08 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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