| 摘要 |
PROBLEM TO BE SOLVED: To attach a sensor for ensuring the safety of an operator prior beforehand when a wafer cassette is transferred, while assuring the opening of doors of an apparatus and, moreover, to enable the sensor to be attached to an existing apparatus. SOLUTION: The front face of a semiconductor manufacturing apparatus 1 is constructed by hinged doors. An opening part 2 for transferring a cassette wafer into the apparatus by operating a cassette loader is formed in each of a left transfer chamber door 8a and a right transfer chamber door 8b in the center among the hinged doors. An optical sensor 10 for sensing an obstacle approaching the opening part 2 is attached to each of right and left door opening boundaries 20 in the opening part 2. The sensor 10 can be rotatably and movably attached via a hinge 12. When doors 8a, 8b, 9a and 9b are opened, the sensors 10 which disturb the opening operation can be rotated and moved to predetermined positions. |
