MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a BGA-type semiconductor device which is easy to mount semiconductor elements, even if the elements are somewhat thick. SOLUTION: Recessed element mounting parts 13 are formed into a metal base sheet, a circuit board sheet having openings 22 corresponding to the element mounting parts 13 is bonded to the metal base sheet to form a semiconductor element mounting board sheet. This sheet is positioned on a carrier plate and moved in directions X and Y by specified distances, semiconductor elements are wire-bonded, the semiconductor elements 14 and wire-bonded parts are sealed with a resin by a potting mold or an injection mold, and solder balls 19 or bumps are formed on outer connection terminal lands of a lead pattern.