| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to surely remove a resist mask without the occurrence of mechanical damage and chemical damage, such as oxidation, in a deposited film at the time of removing the resist mask after the end of a stage using the resist mask 14 in a wafer process of production stages for thin-film magnetic head. SOLUTION: A substrate 10 is immersed into liquid nitrogen to be cooled, after the end of the stage using resist mask 14. A UV curing type tacky adhesive tape 16 is them stuck to the surface of the substrate 10 deposited with the resist mask 14. The UV curing type tacky adhesive tape 16 is heated and is irradiated with UV rays 20 to cure the tacky adhesive. The UV curing type tacky adhesive tape 16 is thereafter peeled from the substrate 10 to peel and remove the resist mask 14 from the substrate 10. |
