发明名称 MULTILAYER CIRCUIT BOARD AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a small multilayer circuit board which never caused defects at the cavity side wall when braking from a mother laminate. SOLUTION: The multilayer circuit board 10 has a laminate 11 of insulation sheets with inner circuit elements inserted between them. On one main surface of the laminate 1 a cavity 12 is formed to mount electronic components such as integrated circuit. At four side faces of the laminate 11, e.g. steps 13 are formed at interfaces of the upper and lower halves 111, 112 of the laminate 1, resulting in that the lower half 112 of height h2 expands outwards along the steps 13, compared with the upper half 111 of a height h1. On the other main surface of the laminate 11 outer electrodes are formed by the screen printing.
申请公布号 JPH10200008(A) 申请公布日期 1998.07.31
申请号 JP19970000329 申请日期 1997.01.06
申请人 MURATA MFG CO LTD 发明人 SAKAI NORIO
分类号 H05K1/02;H01L21/48;H01L23/055;H01L23/12;H01L23/498;H05K1/00;H05K1/11;H05K3/00;(IPC1-7):H01L23/12 主分类号 H05K1/02
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