| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for wire bonding, whereby no deviation occurs in lead positions when actually being bonded and when detecting, apparent detection time is zero and no production efficiency deteriorates. SOLUTION: This apparatus comprises a camera 6, a large-aperture condenser lens 7 disposed between the camera and a lead frame 2, a rotary diaphragm 8 having an opening 9 at a specified position, a motor 10 for driving the diaphragm 8, an illumination lamp 11 fixed to a position symmetric to the opening 9 with an optical axis 0 disposed therebetween, a judging circuit 17 for obtaining the lateral center position of a next lead, using taken image signals to computing from the obtd. center position information the deviation of the next lead from a reference position and control circuit 18 for correcting the bonding position, using the position deviation computed at bonding of the next lead. |
