| 摘要 |
PROBLEM TO BE SOLVED: To simplify the electric conductive bond between both surfaces of an insulation film, by providing a second connections at a part of a circuit pattern on one surface of the film corresponding to a first connections on the other surface of the film; the second connections being adhered to the first ones through a plurality of electrically conductive parts. SOLUTION: Coiled circuit patterns 3 and ICs 4 are formed and connected on both surfaces of a circuit board 5. Connections 1 are provided at a part of the pattern 3, one of them is disposed near the center of a coil and connected to the coil, and another is connected to the IC 4. On the connections 1 electric conductors 2 to be electrically bounded to the connections at the back surface are provided and laid like the 5 spots on a die, corresponding to the five electric conductors 2 per connection 1. The connections 1 and 2 are aligned and pressed and ultrasonic wave is applied. For the front-back connection, the heat and press bonding method may be used. |
