| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealing method and resin-sealing die apparatus whereby the resin seal is made, using a granular resin, without creating voids or poor charging of resin. SOLUTION: A granular resin 1 fed into a pot 6 is heated to be melted and compressed in the pot 6, utilizing a plunger 7 before injecting it in a cavity 9. This compression ejects air, contained among grains of the resin and mixed in the molten resin, thus preventing void defects and poor charging. There is no need to preheat and compress the granular resin once into a tablet, thus eliminating the need for facilities and process therefor. |
