Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate

摘要

PCT No. PCT/DE96/00432 Sec. 371 Date Oct. 22, 1996 Sec. 102(e) Date Oct. 22, 1996 PCT Filed Mar. 12, 1996 PCT Pub. No. WO96/36991 PCT Pub. Date Nov. 21, 1996A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be connected. The surface (10, 20) to be connected of connection (10) is arranged at a distance to and facing a contact surface (45) of a conductive strip (35) on a substrate (30). An electrically conductive material (50) for filling in the free volume between the two surfaces (10, 20; 45) to be connected is applied simultaneously to the contact surface (45) and the surface (10, 20) to be connected.