| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacture of a non-contact IC card wherein a clearance of a vacant space part between a module package and a card base material when the module package in which an IC module is sealed with resin is fabricated by being buried in the vacant space part of the card base material, can be reduced surely in good workability by a simple process, and bonding properties and adhesive of the module package to the card base material can be improved. SOLUTION: When an IC module or the like is sealed with heat curable resin, it is not thoroughly cured, left in a semi-cured state to the degree of being deformed by pressurizing in later heat pressing, and a preliminarily cured module package 10a is prepared. Thereafter, when it is fabricated by being buried in a card base material by heat pressing, the preliminary module package 10a is cured in a state of being deformed by pressurizing, and the module package 10 is buried in the card base material. |
