发明名称 |
Production of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor package |
摘要 |
A semiconductor package has a wiring circuit containing a conductive terminal formed on a first face of a substrate and a flat external connecting terminal electrically connected to the wiring circuit formed on a second face. An electrode pad is formed on a first face of a semiconductor chip. This semiconductor chip is mounted on the substrate with its first face down to oppose the first face of the substrate. A ball bump as a protruded electrode formed on the conductive terminal of the substrate and a ball bump as a protruded electrode formed on the electrode pad of the semiconductor chip are connected by solid phase diffusion. And, a sealing resin layer is formed in the space between the substrate and the semiconductor chip opposed to each other with a second face of the semiconductor chip exposed.
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申请公布号 |
US5786271(A) |
申请公布日期 |
1998.07.28 |
申请号 |
US19960675213 |
申请日期 |
1996.07.03 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OHIDA, MITSURU;AOKI, HIDEO;IWASAKI, HIROSHI |
分类号 |
H01L21/56;H01L21/60;H01L23/28;H01L23/31;H01L23/485;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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