| 摘要 |
PROBLEM TO BE SOLVED: To prevent interposition of foreign matter and deformation of a wafer held by a working pressure, in a wafer holding jig used for grinding or polishing the semiconductor wafer. SOLUTION: In this jig, a porous holding surface for vacuum holding a wafer W is divided into a central region A in the center and an outer side region B in the outside thereof, porosity of the outer side region B is formed smaller than porosity of the central region A. An external diameter of the central region A is formed less than an external diameter of the wafer W, an external diameter of the outer side region B is formed in the external diameter of the wafer W or more, also a vacuum introducing path 5 is made to communicate with the central region A. |
