| 摘要 |
<p>PROBLEM TO BE SOLVED: To protect a semiconductor wafer from adherence of dust generating at the time of laser marking and to ensure laser marking without lowering the yield. SOLUTION: The laser marking device 10 is provided with a transparent marking chamber 13 that is connected to a sucking device through an exhaust pipe 32. In addition, an optical system 12 is arranged in such a manner as a laser beam L is emitted from the lower part of the marking chamber 13, transmitting through the chamber to the lower face 7a of a wafer 7 placed in the chamber 13.</p> |
